Toshiba DC brushless motor drive IC TPD4164F structural analysis report

Package	Die image

Report summary

　In March 2023, Toshiba announced the start of mass production of the TPD4164F DC brushless Motor Driver IC.

One of feature of this product is using a high-voltage SOI process, and has a built-in level shift type high-side driver, low-side driver, overheat protection circuit, low voltage protection circuit, output IGBT, and FRD. LTEC released a Structure Analysis Report clarifying the details of this Brushless Motor Driver IC.

Product specifications/features

• Product number ： TPD4164F Vbus=600V, Iout=2A.
• Product release date: Aug 2023.
• High voltage SOI process.
• Equipped with 6 IGBTs for 3-phase motor inverter drive

Reports Contents/Overview of Results (Refer to P.2 and P.4 for details)

1. Structure analysis Report (79 pages)

• Ag paste is used for die attach.
• IGBT, Diode, and control circuit are formed on one chip (SOI board) and separated by DTI(Deep Trench Isolation).
• Planar gate structure, upper source and collector electrodes are used.
• IGBT and diode area are formed in the output.
• Gate insulating film observation by TEM analysis
• The process node is estimated from M1 pitch and Poly-Si gate length of the control circuit.

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