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2024.10.01

SiC MOSFET(1200V)：ON Semiconductor(equipped in Kia EV6 GT) Structure analysis Reports

Kia EV6 GT (From web information) (https://www.kia.com/uk/new-cars/ev6-gt/#text_441302445) Power c……

2024.10.01

SiC Diode Technology Benchmark Report (STMicro, Infineon, Onsemi)

Report Overview 　First introduced commercially about 20 years ago, SiC Schottky Barrier Diodes (SBDs) have very low tur……

2024.10.01

Body ECU (Rear Unit):BYD Seal (2022) Teardown Report

BYD/Seal Body Controller （Rear Unit） Mounting PCB （Rear Unit） Cited：https://www.byd.com……

2024.10.01

Electronic Motorbike:Honda EM1 e: Teardown Report

Electronic motorbikes: Honda EM1 e: &Mobile Power Pack e: Motorbike Teardown report Battery pack Teardown repo……

2024.10.01

CRRC Gen6 IGBT Power Module (TG950FF08S3-S4A01) Structure Analysis Report

　　 Power module　(TG950FF08S3-S4A01) Report summary  　 This product is an automotive 750V 950A Si-……

2024.10.01

Low Dropout Regulator: Rohm BD933N1WG-CTR Circuit Analysis Report

Package X-ray Chip Overview Report Summary In the automotive sector, the number of electronic ……

2024.10.01

Low-Noise Buck Converter IC: Analog Devices LT8625SP-1 Overview Analysis Report

X-ray Top metal Overview   Analog Devices launched Silent Switcher®3, the latest generation of lo……

2024.10.01

Active EMI Filter：Texas Instruments TPSF12C3-Q1 Circuit analysis report

Package Package X-Ray Chip Overview Overview  EMI countermeasures is getting important due to ……

2024.10.01

GaN HEMT(650V)：STMicroelectronics VIPERGAN50 Structure Analysis Report

Package Photo Chip Photo(GaN HEMT) Chip Photo(Control IC) Overview  In April 2022, STM……

2024.10.01

LiDAR:Continental HFL110TA Teardown Report

LiDAR: Light Distance And Ranging 　　　　　　                                                  Product a……

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