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2024.10.01

Inverter:BYD (Qin Plus DM-i PHEV (2021)) Teardown Report

BYD Qin Plus DM-i PHEV (2021) ※from Web information Inverter Overview INV con……

2024.10.01

Voltage Converter:Panasonic (Mercedes-Benz EQS (2021)) Teardown Report

Overview PCB Overview  With the spread of electrification of cars and self-driving systems, the p……

2024.10.01

CoolGaN Half-Bridge IPS Modules: Infineon IGI60F1414A1L Gate driver IC overview Analysis Report

Inside the package Appearance of the high-side gate driver IC chip Overview In order to achieve c……

2024.10.01

GaN FET built in Half bridge driver (Infineon IGI60F1414A1L) Circuit Analysis Report (Partial)

Hi-side Gate driver IC Function block (Analysis area) Product features  Infineon has already rele……

2024.10.01

GaN HEMT Power Stage IC : ROHM BM3G007MUV-LB (EcoGaN) Gate driver IC Overview Analysis Report

Inside the package Gate driver chip overview Overview In order to achieve carbon neutrality and a……

2024.10.01

GaN FET with Integrated Driver: Texas Instruments LMG3522R030-Q1 Gate driver IC Overview Analysis Report

Inside the package (Bottom View) Gate driver IC chip overview Overview By the electrification of ……

2024.10.01

Sapphire Radis Xeon Gold 6434 Package analysis report

CPU & EMIB EDX spectrum Xeon Gold 6430 Coax Mil (X-ray) Abstract While Intel ……

2024.10.01

Fuji Electronics IGBT(1200V)_FGW75XS120C Structure analysis Report

Package appearance Internal layout Die photograph Abstract Fuji Electric has added a new low-l……

2024.10.01

SiC MOSFET(1200V)：Wolfspeed (mounted on Lucid Motors Lucid Air) Power module EAB450M12XM3 Structure

Power module appearance Inside the power module SiC MOSFET die Report summary In September 202……

2024.10.01

Inverter:Hyundai MOBIS (Kia EV6 GT, Rear) PCB Circuit Analysis Report

Kia EV6 GT Cited: https://www.kia.com/uk/new-cars/ev6-gt/#text_441302445 Rear Inverter Overview R……

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