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2024.10.08

HestiaPower SiC MOSFET H2M120F080 Structure Analysis Report

Package appearance SiC MOSFET die (Top Metal) Report summary  The SiC market is rapidly growing d……

2024.10.08

Exynos W920 equipped with Galaxy Watch4 Galaxy Watch4FO-PLP (Fan Out Panel Level Package) analysis report

FO-PLP cross section Galaxy Watch4 PLP and WLP area comparison （Source：Samsung Electron……

2024.10.08

Structural analysis report of ROHM Si capacitor (BTD1RVFLT27N102)

Package Cross-section (CP-SEM) Introduction  The Si capacitor market is predicted to grow at a CA……

2024.10.08

Power Supply for PC Server:Lite-ON Technology DD-2162-2J (1600W) Circuit Analysis Report

DD-2162-2 J Overview DD-2162-2J Inside Label Overview 　This LITE-ON power supply unit for Fuji……

2024.10.08

SiC MOSFET(1200V)：Coherent TM3B0020120A Structure Analysis Report

Package appearance SiC MOSFET die Overview  Coherent, Inc. in USA (formerly Ⅱ-Ⅵ) is a global ……

2024.10.08

Apple M3 package board wiring layout (comparison with M1) report

Apple M3 processor Report summary In November 2023, MacBook Pro equipped with Apple M3 proce……

2024.10.08

AC Normal Charge Port:Tesla Wall Connector Gen3 PCB Circuit Analysis Report

Source: https://www.tesla.com/ Product Overview Overview  Tesla, Inc. of the U.S. has r……

2024.10.08

AC Normal Charge Port:Tesla Wall Connector Gen3 Teardown Report

Overview of Tesla Wall Connector Gen3 Main PCB Overview 　Tesla Inc. has announced its pol……

2024.10.08

OBC:NetPower CA16K6-2AL Teardown Report

Module Overview After remove the cover Overview In the Battery EV area it is required to shorten ……

2024.10.08

ICCU:Hyundai Mobis (Hyundai IONIQ5 EU Model) Circuit Analysis Report

ICCU: Integrated Charging Control Unit Hyundai Mobility IONIQ5 Reference：https://www.hyu……

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