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2024.11.06

Electric Compressor:BYD SEAL PCB Circuit Analysis Report

BYD SEAL Cited: https://www.byd.com/eu/car/seal Compressor (Bird View) Compressor control board ……

2024.11.06

Apple M3 package board wiring layout (comparison with M1) report

Apple M3 processor Report summary In November 2023, MacBook Pro equipped with Apple M3 processor was……

2024.11.06

ICCU:Hyundai Mobis (Hyundai IONIQ5 EU Model) Teardown Report

Hyundai Mobility IONIQ5 Cited from：https://www.hyundai.com/jp/ioniq5 IONIQ5 ICCU Overview  Hyu……

2024.11.06

Isolated GaN FET Gate Driver: Allegro MicroSystems AHV85110 Structural analysis Report

Package X-ray Die image (Primary) Die image (Secondary) Report summary  In June 2023, Alleg……

2024.11.06

SiC MOSFET(1200V)：Nexperia NSF080120L3A0 Structure Analysis Report

Package SiC MOSFET Report summary In November 2023, Mitsubishi Electric and Nexperia announced jo……

2024.11.06

Power Supply for PC Server:Fujitsu DPS-800AB-28A (800W) Teardown Report

DPS-800AB-28A Overview Inside DPS-800AB-28A Label Overview  This product is a power supply uni……

2024.11.06

Power Supply for PC Server:Fujitsu DD-2162-2J (1600W) Teardown Report

DD-2162-2J Overview Inside DD-2162-2J Label Overview 　This product is the power supply unit in……

2024.11.06

Analysis of NXP-Microprocessor (S32G274A)

Top View Bottom View Report summary  The S32G274A is an in-vehicle network processor of the S32G2……

2024.11.06

Non-Isolated 48V12V DCDC:Murata (for Electric Bike) MYPMA01218RCF-CAB Teardown Report

Product appearance Overview Amid the rapid increase in the number of devices powered by batteries, e……

2024.11.06

GaN HEMT(150V)： Rohm EcoGaN GNE1040TB Structure Analysis Report

 　 Package appearance GaN die Report summary In 2022, ROHM announced its entry into the GaN device……

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