CMOS Image Sensor: Apple iPhone13 Pro Main Camera Structural and Layout Analysis Report
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| Optical microscope photograph | Planar SEM photograph | Cross-sectional SEM photograph |
Overview
This product is a stacked CIS (Complementary Metal-Oxide-Semiconductor) for the main wide-angle camera of the iPhone 13 Pro. Based on manufacturer specifications, it features 100% autofocus functionality within each effective pixel. The pixel size is 1.9µm, and structurally, it utilizes Cu-Cu bonding technology, making it a stacked CIS for both pixels and ISP (Image Signal Processor).
In this report, we will verify the actual performance through physical analysis of the mentioned features and technologies. Additionally, we will clarify any applied technologies, processes, and the ISP side layout that may not be explicitly specified in the product specifications.
Product features
- Sony stacked CMOS image sensor, Model Number: IMX703
Report Contents (48 pages)
iPhone 13 Pro Main Camera CMOS Image Sensor (Stacked-CIS) Structure & Layout Analysis Report
- Cross-sectional structure analysis
- Pixel-side layout analysis
- ISP-side layout analysis
- Determination of applied processes and manufacturing foundry
Report price
Delivered one week after order placement
Please contact us for report pricing.
