semiconductor

Apple M3 package board wiring layout (comparison with M1) report


	Apple M3 processor

Report summary

In November 2023, MacBook Pro equipped with Apple M3 processor was released.

M3 has memory bandwidth that is about 1.5 times faster than M1, and has improved image processing performance with the same power consumption as M1.

In order to increase memory bandwidth, in addition to increasing the performance of the on-board memory, it is also thought that the wiring pattern should be devised and improved. We analyzed the planar layout of the package substrate and compared it with the signal wiring between the processor memory chips on the M1 substrate that we had analyzed in the past.

Both are 8 layers package substrate. M3 has 9 Si-Caps in the substrate and M1 has 6 Si-Caps.

Product features

	M1	M3
CPU cores	8	8
GPU cores	7 or 8	10
FLOPS	2.6TFLOPS※1	4.3TFLOPS※2
Memory bandwidth	68.25GB/s	100GB/s
Mounted capacitors	34	42
Standby power※3	43W	43W
Maximum power consumpiton※3	84W	85W