APEC 2018 (Applied Power Electronics Conference and Exhibition)

LTEC Corporation presents at the Industry Session on Wednesday, March 7th.

”Modeling Thermal Impedance of GaN and SiC Power Transistors　Under Short Circuit Conditions”

We propose methodology to create a more accurate thermal model based on data obtained
from physical construction analysis of commercially available GaN and SiC devices. The new
short-circuit thermal transient model obtained in this manner yields a more precise estimate
of the peak junction temperature than what’s predicted by most datasheets.​

At our
Exhibitor Seminar
you will have the opportunity to learn about ways to identify wide bandgap power device technology trends through benchmarking and deep analysis.
Please plan to attend and come to visit us at Exhibit Booth 305.