Apple M3 package board wiring layout (comparison with M1) report
 |
| Apple M3 processor |
Report summary
In November 2023, MacBook Pro equipped with Apple M3 processor was released.
M3 has memory bandwidth that is about 1.5 times faster than M1, and has improved image processing performance with the same power consumption as M1.
In order to increase memory bandwidth, in addition to increasing the performance of the on-board memory, it is also thought that the wiring pattern should be devised and improved. We analyzed the planar layout of the package substrate and compared it with the signal wiring between the processor memory chips on the M1 substrate that we had analyzed in the past.
Both are 8 layers package substrate. M3 has 9 Si-Caps in the substrate and M1 has 6 Si-Caps.
Product features
|
|
*1:References：https://applech2.com/archives/20220623-apple-m2-macbook-pro-2022-cpu-and-gpu-benchmark.html *2 References：https://www.cpu-monkey.com/ja/igpu-apple_m3_10_core *3 References：https://support.apple.com/en-us/HT201918 |
Report contents (36 pages)
- Teardown process of MacBook Pro
- Each layer patterns of M3 package substrate
- Comparison between M1 and M3
Report Price
Please contact us for report pricing
Delivered within 1 week after ordering
