Analysis results by LTEC
We analyze over 1,000 products each year using our analysis techniques refined over decade.
Automotive parts
Inverters/converters/OBC (on board charger)/BMS (battery monitor system)/ADAS and LiDAR/sensors/engine ECUs/various motors, etc.
Medical devices
Ultrasonic probes/endoscopes/catheters/hearing aids/blood glucose meters/oxygen analyzers/blood-pressure monitors/digital thermometers, etc.
Consumer products
Smartphones/drones/e-bikes/digital cameras/LCDs, EL-TV/game machines/electric power tools/white goods, etc.
Semiconductor products
Processors/Memory/Analog IC/RF devices/BMS (battery monitor system) IC/CMOS image sensors/Sensors /MEMS/Driver IC/Power devices (Si/SiC and GaN)/Passive components, etc.
Analysis results varieties
| Analysis results varieties | |
|---|---|
| Processor | MPU (Structure: 14nm process, Circuit: 32nm process), MCU (90nm process), DSP |
| ASIC | |
| Single memory | DRAM, SRAM, MRAM, Flash (1xnm process) |
| Mixed memory | SRAM、Flash、ROM、EEPROM、FeRAM、eFuse |
| Communication IC | Wireless (5GHz band): Wi-Fi, Wireless (2.4GHz band): Bluetooth / ZigBee / Wi-Fi, Wireless (Other): NFC / RF tag IC / IC / CDMA front end for specific low power, Wired: USB / Ethernet (40Gbps) |
| RF | FBAR, SAW filter, power amplifier module, RF switch, LNA, PA (CMOS, compound), tuner IC, receiver for radio clock |
| Power supply system IC | LDO, battery monitor, battery protection IC, wireless power supply controller IC, DC-DC converter (step-down, buck-boost, switched capacitor), AC-DC controller, photo coupler |
| Data conversion | AD converter (SAR, ⊿Σ, Pipeline, Hybrid), DA converter |
| power | FET, IGBT, GaN, SiC- MOSFET (planer type, trench type), SBD |
| Driver IC | "Motor driver, high side driver, LCD driver (55nm process), LED driver" |
| Video / audio IC | Audio CODEC, audio amplifier, image engine for TV, image processing IC for medical cameras, digital camera image processing engine |
| display | LCD, OLED, electronic paper, LCOS |
| Image sensor | Motion sensor, accelerometer, gyro sensor, magnetism, pressure, micro mirror |
| Sensor | "CMOS sensor for single-lens reflex camera, CMOS sensor for smartphone, back-illuminated CMOS sensor, laminated back-illuminated CMOS sensor (TSV adopted)" |
| MEMS | "Accelerometer, gyro sensor, hall sensor, geomagnetism, pressure, microphone, temperature / humidity, fingerprint, proximity, photoelectric" |
| substrate | Smartphones, PC supplies, LED fluorescent lights, communication equipment, power supplies (AC adapters, power conditioners, UPS, inverters for industrial motors), home appliances (various white goods, inverters, watches), sensors (distance measurement, proximity, gestures) , Healthcare (blood glucose meter, pulse wave sensor, insulin pump, ultrasonic measuring instrument), in-vehicle (inverter, DC-DC converter, charger, various ECUs, information display, communication unit, millimeter wave radar) |
| Set product | In-vehicle modules / units, medical devices, digital cameras, DVD drives |
| others | LED, LD, Si interposer |
Survey results field
| Survey results field | |
|---|---|
| Memory device | "DRAM, DDR, SRAM, ROM, EEPROM, FLASH, etc., address system / input / output system / power supply system circuit, other peripheral circuits" |
| Power device | Process, structure, layout |
| Processor | For communication, for image processing, for games and gaming machines |
| Sensor | Image sensor, magnetic sensor, temperature sensor |
| Semiconductor laser / LED | |
| Car electronics | Drive system, mechanical system, structural system |
| display | For communication and image processing |
| ADC/DAC | Frequency modulation method (QAM / OFDM etc) |
| Wired / wireless LAN system | |
| In-vehicle LAN / CAN | Capacitor structure, layout, CVD / PCVD, element separation, etching, polishing / CMP |
| Lithography | Bonding, sealing, assembly, bump electrodes, MCM |
| Implementation | |
| Li ion battery | |
| Fuel cell | |
| Optical technology |
