Exynos W920 equipped with Galaxy Watch4 Galaxy Watch4FO-PLP (Fan Out Panel Level Package) analysis report

		FO-PLP cross section
Galaxy Watch4	PLP and WLP area comparison
（Source：Samsung Electronics）	(image)	FO-WLP cross section
（Source：SEMICONCUCTOR ENGINEERING）

Summary

　 FO-PLP (Fan Out Panel Level Package) is a technology comparable to TSMC‘s FO-WLP (Fan Out-Wafer Level Package). FO-PLP can have a larger area than FO-WLP, which is manufactured at the wafer level, and can manufacture packages three to four times as large at once, but it is required to take care its strength. Samsung Electronics was the first company in the world to begin mass production of FO-PLP, and the wearable processor Exynos W920, which uses this technology, was installed in the Galaxy Watch4. The Exynos W920 is a POP-package manufactured using redistribution layer (RDL) , and it is presumed that issues related to strength, such as warpage countermeasures, have been overcome. In this report, we analyze the structure of Exynos W920 (FO-PLP) and compare it with TSMC (FO-WLP: A10).The RDL of Exynos W920 is filled with filler only in specific layers, and the interlayer resin is also filled  It became clear that there was a layer with added trace elements. We believe that these factors lead to improved strength, and we have created a report.　

Report Contents (52 pages)

• Cross-section and Material analysis (EDX)
• Each layer patterns of RDL
• Process flow estimation based on analysis result
• Comparison with TSMC (FO-WLP)