CMOS Image Sensor: Apple iPhone14 Pro Main Camera Structural and Layout Analysis Report
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| Optical Microscope Photo | Planar SEM Photo | Cross-sectional SEM Photo |
Overview
This product is a stacked CIS for the main wide-angle camera of iPhone14Pro. Based on manufacturer specifications, it has 100% autofocus functionality within the effective pixels. The pixel size is 1.2µm, and structurally, it is a pixel/ISP stacked CIS using Cu-Cu bonding technology, among others. Its key feature lies in preventing resolution degradation and reducing noise under low-light conditions through the application of Quad Bayer array.
In this report, we verify the actual performance of the above functions and technologies through physical analysis. Additionally, we investigate applied technologies, application processes, and ISP-side layouts that are not clear from the specifications.
Product features
- Sony Stacked CMOS Image Sensor, Model: IMX803
Report Contents (50 pages)
iPhone14 Pro Main Camera CMOS Image Sensor (Stacked-CIS) Structure & Layout Analysis Report
- Cross-sectional structure analysis
- Pixel side layout analysis
- ISP side layout analysis
- Determining applicable process & manufacturing foundry
Report price
Delivered one week after order placement
Please contact us for report pricing.
